Parylene Deposition: Understanding the Gorham Process Parylene is a polymer that cannot be applied by brush, dipping, or spraying. It forms directly on the part to be protected, molecule by mole...

PECVD Principle Depositing SiO₂ by conventional CVD takes substrate temperatures of several hundred degrees, which rules out electronics, solder joints and polymers. PECVD replaces thermal energ...

ALD Principle CVD and PECVD are continuous processes: precursor flows in, the film grows, and thickness is set by deposition time. ALD, developed by Tuomo Suntola in the 1970s, splits the growth...

A Polymer to Protect the Electronics Parylene is a widely used material that is mostly applied on critical electronic circuit to provide a strong protection in harsh environment. Especially fo...