A wide variety of substrates can be coated with parylene: metals, plastics, elastomers, plants, insects, or archaeological objects. Porous substrates such as paper and membranes can also be coated. The process is compatible with any substrate that is stable under partial vacuum.

Parylene complies with REACH, RoHS, and California Proposition 65 regulations. It is free of PFOA and PFOS. Parylene is considered a “green” polymer because its polymerization requires no initiator or other chain-terminating chemicals, and coatings can be applied at room or near-room temperature without solvents.

When preparing a budget estimate, five key factors are evaluated: the dimensions of the parts (how many fit per load chamber), the masking requirements (number and complexity of prohibited areas), the annual production volume, the manufacturing location, and the operating environment.

The coating thickness is measured using non-destructive methods such as profilometry or spectroscopic ellipsometry to ensure the desired thickness is achieved. Defect detection relies on high-voltage current leakage detection or dye penetration testing. colorant.

For chemical and moisture protection of printed circuit boards and medical devices, components are typically coated with a layer of 5 to 25 µm depending on the application. Most IPC-CC-830 and MIL-I-46058 standards require a minimum thickness of 12.5 µm (0.5 mil).

Yes, parylene resists most sterilization processes, including autoclave (steam), gamma irradiation, ethylene oxide (EtO) and hydrogen peroxide plasma, making it ideally suited for reusable and single-use medical devices.

Parylene conforms to MIL-I-46058 Type XY, IPC-CC-830B and USP Class VI standards, and is ISO 10993 approved for use as a biocompatible and implantable medical material.

Imperfections such as bubbles and pitting can compromise the protective properties of parylene. Thorough degassing of the components before coating eliminates trapped air or moisture, the primary cause of these defects. Optimizing the deposition pressure and temperature also promotes a uniform, pitting-free film.

Yes. Although parylene cannot be chemically removed, it can be eliminated by heat (soldering iron) or mechanical abrasion (brushing, scraping, or bead blasting). More delicate or precise removal can be achieved by laser or plasma ablation. The exposed area is usually repaired using an acrylic or urethane touch-up paint.

The easiest way to determine if a part is coated is to look for a demarcation line: the point where the masked and coated areas meet. Using a magnifier is helpful.

Yes. However, this coating process creates two distinct layers of parylene, not a single homogeneous layer. The adhesion between the two layers must be verified for demanding applications.

Custom masking techniques include liquid latex, RTV silicones, a wide range of adhesive tapes, adhesive pads, and any number of caps and sleeves of various sizes and configurations.

The most common types of contamination are fingerprints, salts, flux residue, adhesive tape, or glue residue. Cleaning and drying the parts before coating improves coating adhesion, makes the product more reliable, and extends the device’s lifespan.

No, parylene does not require any curing. It adheres to parts without any internal stress. Unlike epoxies or acrylics, it requires neither UV curing, nor thermal curing, nor solvent evaporation.

Yes, parylene is hydrophobic. It repels water and liquids on the surface, which contributes to its excellent moisture barrier properties.

The parylene film, with a thickness of micrometers, adds virtually no mass, a crucial advantage for aerospace applications and portable devices where every gram counts.

Parylene C has a maximum elongation of 200%, and parylene N an elongation of 40%. The coating is therefore flexible enough to withstand repeated thermal cycles and mechanical stresses without cracking.

Yes, the ultra-thin coatings of Parylene C and N are colorless and transparent. This makes them particularly suitable for optical applications such as LED assemblies, sensors, and watchmaking.

Masking is applied before the parts enter the CVD chamber using special vacuum-resistant adhesive films, plugs, mechanical fasteners, or photomasks. This step is crucial because the parylene is deposited on all surfaces exposed to the gas, including connector contacts. Some advanced grades eliminate the need for connector masking altogether.

Under normal conditions of use (ambient temperature, limited UV exposure), the lifespan exceeds 20 years. For implantable applications, accelerated aging studies demonstrate stability over several decades. The VT4/AF4 grade offers the best resistance to aging, particularly to UV radiation.

Yes, parylene is compatible with most industrial sterilization processes: steam sterilization (autoclave up to 135°C depending on the grade), gamma irradiation, ethylene oxide (EtO) and H₂O₂ plasma. This is a major advantage for medical devices.

The thickness depends on the application. For basic electrical insulation: 1 to 5 µm. For moisture protection in electronics: 5 to 25 µm. For long-term implantable applications: 10 to 40 µm, sometimes with composite layers. Most IPC and MIL standards require a minimum thickness of 12.5 µm (0.5 mil).

Yes. N, C, and VT4/AF4 grades are biocompatible according to ISO 10993 and USP Class VI. Parylene C has been used since the 1970s in active, long-term implantable medical devices. It is FDA-approved and does not cause significant tissue reactions.