- Multilayer EncapsulationThe Parylene based Multilayer creates a physical and chemical barrier between device and the environment in which it should be used – this is the first product offered by Coat-X. Our multilayer packaging technology meets our customers’ most demanding space, performance and cost specifications.https://youtu.be/HqworuM9SUU
The solutions we have developed meet our customers’ demands and the highest international performance standards for tightness, corrosion resistance and biocompatibility.
- Technological Advantages:
- • Hermetic and biocompatible thin-film packaging for smart implantable devices.
- • Silicon oxide / Parylene-C multilayers are deposited by a novel single-chamber process.
- • The process guarantees a close-to-ideal conformity over three-dimensional structures.
- • Deposition process occurs at room temperature.
The following figure illustrates a conventional package using surrounding glass or metal jackets (a).
A considerable decrease in packaging volume can be achieved by the novel thin-film layer encapsulation method for biomedical devices (b).
- Medical (implants or external devices)
- Aerospace (high-tech sensors)
- Watchmaking (long-term protection)
- Pharma (long-term encapsulation)
The solutions developed to date have allowed us to meet the demand of our customers in line with the highest international performance standards (tightness, corrosion resistance, biocompatibility).
Ultra-flexible Smart Devices
Using the flexible film as a carrier, the thin conductors – such as gold that is only a few nanometers thick – can be deposited to create an ultra-flexible circuit. Conventional electronic components can then be soldered to the conductors or directly integrated into the layer. With a second multi-layer deposited on these circuits, the assembly is completely waterproof while remaining flexible.